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ЁЁЁЁKey Words: multi-layer ceramic capacitors; finite element; simulation; thermal stress;

ФП  ТМеЊ  вЊ 3Abstract 4Ек1еТ в§бд 51.1 БГОАМАвтвх 51.1.1ТлЮФбЁЬтБГОА 51.1.2ТлЮФбЁЬтвтвх 61.2 баОПНјГЬгыЧїЪЦ 61.2 БОТлЮФЕФбЁЬтвРОнКЭбаОПФкШн 9Ек2еТ MLCCЬеДЩЕчШн 92.1 MLCCЕФзщГЩ 92.2 MLCCЗжРр 112.3 MLCCЩњВњСїГЬ 112.4 MLCCдкRFЕчТЗжаЕФгІгУ 132.4.1ОЋЖШ(ЃЅ) 132.4.2ЖюЖЈЕчбЙ(WVDCЛђVR) 132.4.3ЕчШнСП(pFЃЉ 132.4.4аЁНс 15Ек3еТ гаЯодЊЗЈдкЬеДЩЩњВњжаЕФгІгУ 163.1 гаЯодЊЗЈЕФЛљБОд­Рэ 163.1.1ЮяЬхРыЩЂЛЏ 163.1.2ЕЅдЊЬиадЗжЮі 163.1.3ЕЅдЊзщМЏ 163.1.4ЧѓНтЮДжЊНкЕуЮЛвЦ 173.2 гаЯодЊЗЈдкЬеДЩжаЕФгІгУ 173.2.1ЬеДЩЧђФЅЛњгХЛЏЩшМЦ 173.2.2ЬеДЩФрНЌГ§Ьњ 173.2.3ЬеДЩГЩаЭЩшБИЩшМЦ 183.2.4ЬеДЩВњЦЗЩеГЩЙ§ГЬ 183.2.5ЬеДЩХзЙтзЉМгЙЄ 183.2.6аЁНс 19Ек4еТ зм  Нс 20ВЮПМЮФЯз 21жТ  аЛ 22